Semiconductor device including electronic component coupled to a backside of a chip

US8350382B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Edward Fürgut · Dasing, DE
• Joachim Mahler · Regensburg, DE
• Michael Bauer · Nittendorf, DE

Key dates

• Filing date: Sep 21, 2007
• Grant date: Jan 8, 2013
• Expiry date: Jan 6, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.