Laser processing apparatus
US8354612B2 · kind B2 · utility
0Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2010 |
| Grant date | Jan 15, 2013 |
| Priority date | — |
| Expiry date | Apr 6, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.