Polishing apparatus
US8357029B2 · kind B2 · utility
5Cited by
31References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2009 |
| Grant date | Jan 22, 2013 |
| Priority date | — |
| Expiry date | May 19, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.