Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
US8357564B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2010 |
| Grant date | Jan 22, 2013 |
| Priority date | — |
| Expiry date | Mar 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4682
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A prefabricated multi-die leadframe having a plurality of contact pads is mounted over a temporary carrier. A first semiconductor die is mounted over the carrier between the contact pads of the leadframe. A second semiconductor die is mounted over the contact pads of the leadframe and over the first die. An encapsulant is deposited over the leadframe and first and second die. The carrier is removed. A first interconnect structure is formed over the leadframe and the first die and a first surface of the encapsulant. A channel is cut through the encapsulant and leadframe to separate the contact pads. A plurality of conductive vias can be formed through the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant opposite the first surface of the encapsulant. The second interconnect structure is electrically connected to the conductive vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.