Patent · US Active

Method for producing semiconductor wafers composed of silicon having a diameter of at least 450 mm, and semiconductor wafer composed of silicon having a diameter of 450 mm

US8357590B2 · kind B2 · utility

0Cited by

1References

2Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Georg Raming · Tann, DE
Walter Heuwieser · Stammham, DE
Andreas Sattler · Trostberg, DE
Alfred Miller · Emmerting, DE

Key dates

Filing date	Jan 13, 2011
Grant date	Jan 22, 2013
Priority date	—
Expiry date	Feb 9, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/21
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Silicon semiconductor wafers are produced by:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.