Method for optimized removal of wafer from electrostatic chuck
US8363378B2 · kind B2 · utility
8Cited by
12References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2009 |
| Grant date | Jan 29, 2013 |
| Priority date | — |
| Expiry date | Nov 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.