Bend test method and apparatus for flip chip devices
US8365611B1 · kind B1 · utility
2Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2009 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Oct 13, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0226
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bend test method includes bending a flip chip device into a bent configuration, heating the flip chip device, and inspecting the flip chip device for failure. The bend test method is completed in a relatively short amount of time, e.g., within one to three days. Thus, appropriate failure modes in flip chip devices are created in an accelerated manner so that reliability assessment of various flip chip device designs, materials, and process options can be completed in a few days instead of a few months. This greatly reduced development cycle time typically results in a larger market share for new flip chip device products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.