Solderable top metalization and passivation for source mounted package
US8368211B2 · kind B2 · utility
9Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2004 |
| Grant date | Feb 5, 2013 |
| Priority date | — |
| Expiry date | Nov 5, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silver-containing solderable contact on a semiconductor die has its outer edge spaced from the confronting edge of an epoxy passivation layer so that, after soldering, silver ions are not present and are not therefor free to migrate under the epoxy layer to form dendrites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.