Martin Carroll
7Patents
3h-index
13Co-inventors
54Inventor score
Filing activity: Sep 15, 1982 → Jan 31, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8368211B2 | Solderable top metalization and passivation for source mounted package | Electricity | 9 | Expired |
| US4499693A | Method of grinding non-uniform workpieces | Performing Operations; Transporting | 5 | Expired |
| US8143729B2 | Autoclave capable chip-scale package | Electricity | 3 | Active |
| US8536645B2 | Trench MOSFET and method for fabricating same | Electricity | 1 | Active |
| US8125083B2 | Protective barrier layer for semiconductor device electrodes | Electricity | 1 | Active |
| US9852940B2 | Method for forming a reliable solderable contact | Electricity | 0 | Active |
| US9852939B2 | Solderable contact and passivation for semiconductor dies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.