Method for testing electronic components of a repetitive pattern under defined thermal conditions

US8368413B2 · kind B2 · utility

Inventors

• Stojan Kanev · Sacka, DE
• Frank Fehrmann · Hengshan, TW
• Jens Fiedler · Potsdam, DE
• Claus Dietrich · Sacka, DE
• Jorg Kiesewetter · Thiendorf, DE

Key dates

• Filing date: Sep 1, 2009
• Grant date: Feb 5, 2013
• Expiry date: Sep 1, 2029

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2891
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the probes (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (…