Patent · US Active

Post CMP scrubbing of substrates

US8372210B2 · kind B2 · utility

12Cited by

43References

11Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Garrett H. Sin · San Jose, US
Terry Kin Ting Ko · South San Francisco, US
Sidney P. Huey · Fremont, US

Key dates

Filing date	Oct 11, 2008
Grant date	Feb 12, 2013
Priority date	—
Expiry date	Jun 24, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67046
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.