Substrate polishing apparatus and method of polishing substrate using the same
US8382554B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2009 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Jul 9, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a substrate polishing apparatus and a method of polishing a substrate using the same. The substrate polishing apparatus includes a substrate supporting member, a polishing unit, and a control unit. The substrate is seated on the rotatable substrate supporting member. The polishing unit includes a rotatable and swingable polishing pad to polish a top surface of the substrate. The control unit controls the substrate supporting member and the polishing unit during a polishing process to adjust a value of a polishing variable adjusting a polishing amount of the substrate according to a horizontal position of the polishing pad with respect to the substrate. Therefore, the substrate polishing apparatus may locally adjust the polishing amount of the substrate to improve polishing uniformity and product yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.