Bond pad design for enhancing light extraction from LED chips
US8384115B2 · kind B2 · utility
1Cited by
27References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 1, 2008 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | May 1, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
Abstract
An improved bond pad design for increased light extraction efficiency for use in light emitting diodes (LEDs) and LED packages. Embodiments of the present invention incorporate a structure that physically isolates the bond pads from the primary emission surface, forcing the current to flow away from the bond pads first before traveling down into the semiconductor material toward the active region. This structure reduces the amount of light that is generated in the area near the bond pads, so that less of the generated light is trapped underneath the bond pads and absorbed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.