Ting Li
22Patents
11h-index
24Co-inventors
75Inventor score
Filing activity: Jul 23, 2001 → Jan 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6444551B1 | N-type buried layer drive-in recipe to reduce pits over buried antimony layer | Electricity | 123 | Expired |
| US6972438B2 | Light emitting diode with porous SiC substrate and method for fabricating | Electricity | 58 | Expired |
| US7915629B2 | Composite high reflectivity layer | Electricity | 37 | Active |
| US8034647B2 | LED with substrate modifications for enhanced light extraction and method of making same | Electricity | 33 | Active |
| US8017963B2 | Light emitting diode with a dielectric mirror having a lateral configuration | Electricity | 31 | Active |
| US7932106B2 | Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming | Electricity | 23 | Active |
| US8680556B2 | Composite high reflectivity layer | Electricity | 19 | Active |
| US7534633B2 | LED with substrate modifications for enhanced light extraction and method of making same | Electricity | 16 | Expired |
| US8710536B2 | Composite high reflectivity layer | Electricity | 15 | Active |
| US8598609B2 | Composite high reflectivity layer | Electricity | 15 | Active |
| US9362459B2 | High reflectivity mirrors and method for making same | Electricity | 14 | Active |
| US7508032B2 | High voltage device with low on-resistance | Electricity | 10 | Active |
| US8617909B2 | LED with substrate modifications for enhanced light extraction and method of making same | Electricity | 4 | Active |
| US8507924B2 | Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming | Electricity | 3 | Active |
| US8384115B2 | Bond pad design for enhancing light extraction from LED chips | Electricity | 1 | Active |
| US8759868B2 | Ultra-thin ohmic contacts for p-type nitride light emitting devices | Electricity | 0 | Active |
| US7893490B2 | HVNMOS structure for reducing on-resistance and preventing BJT triggering | Electricity | 0 | Active |
| US8089090B2 | Ultra-thin ohmic contacts for p-type nitride light emitting devices | Electricity | 0 | Active |
| US10043942B2 | Vertical multi-junction light emitting diode | Electricity | 0 | Active |
| US12368074B2 | Manufacturing method of semiconductor structure comprising a gap and semiconductor structure comprising a gap | Electricity | 0 | Active |
| US8686460B2 | Ultra-thin ohmic contacts for p-type nitride light emitting devices | General | 0 | Revoked |
| US8044425B2 | Ultra-thin ohmic contacts for p-type nitride light emitting devices | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.