Sensor device with sealing structure
US8384168B2 · kind B2 · utility
5Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2011 |
| Grant date | Feb 26, 2013 |
| Priority date | — |
| Expiry date | Apr 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.