Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids
US8387635B2 · kind B2 · utility
8Cited by
89References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2007 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.