Patent · US Active

Circuit board having pad and chip package structure thereof

US8389869B2 · kind B2 · utility

0Cited by

4References

11Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventor

Ko-Wei Lin · Taichung, TW

Key dates

Filing date	Sep 4, 2009
Grant date	Mar 5, 2013
Priority date	—
Expiry date	Aug 13, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A circuit board including a substrate, a conductive pattern and a solder mask layer is provided. The conductive pattern includes a pad, a tail trace and a signal trace. The tail trace connects with the edge of the pad and the signal trace connects with the edge of the pad. An angle between a portion of the signal trace neighboring the pad and the tail trace is larger than 0 degree and smaller than 180 degree. The solder mask layer is disposed on the substrate and covers a portion of conductive pattern. The solder mask layer has an opening exposing the whole pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.