Ko-Wei Lin
10Patents
1h-index
29Co-inventors
50Inventor score
Filing activity: Sep 4, 2009 → Jun 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10756128B2 | Integrated circuit device and method of fabricating integrated circuit | Electricity | 4 | Active |
| US10153231B2 | Interconnect structure and fabrication method thereof | Electricity | 1 | Active |
| US9966425B1 | Method for fabricating a MIM capacitor | Electricity | 0 | Active |
| US10446489B2 | Interconnect structure | Electricity | 0 | Active |
| US8389869B2 | Circuit board having pad and chip package structure thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US12237395B2 | High electron mobility transistor and method for forming the same | Electricity | 0 | Active |
| US11404631B2 | MRAM structure and method of fabricating the same | Physics | 0 | Active |
| US8089164B2 | Substrate having optional circuits and structure of flip chip bonding | Electricity | 0 | Active |
| US11856870B2 | MRAM structure and method of fabricating the same | Physics | 0 | Active |
| US10079177B1 | Method for forming copper material over substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.