Methods of forming semiconductor device structures and semiconductor device structures including a uniform pattern of conductive lines
US8390051B2 · kind B2 · utility
6Cited by
6References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 27, 2010 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming semiconductor device structures are disclosed. One method comprises forming a plurality of loops of a conductive material. Each loop of the plurality of loops comprises a uniform pattern. In one embodiment, a portion of the conductive material is removed from at least one location in each loop of the plurality of loops. Contacts are formed to the conductive material. A semiconductor device structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.