Advanced process control with novel sampling policy
US8392009B2 · kind B2 · utility
3Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2009 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | May 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a first plurality of semiconductor wafers; determining a sampling rate to the first plurality of semiconductor wafers based on process quality; determining sampling fields and sampling points to the first plurality of semiconductor wafers; measuring a subset of the first plurality of semiconductor wafers according to the sampling rate, the sampling fields and the sampling points; modifying a second process according to the measuring; and applying the second process to a second plurality of semiconductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.