Integrated circuit package system with heatspreader
US8395254B2 · kind B2 · utility
6Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Jul 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.