Hybrid memory module
US8397013B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2008 |
| Grant date | Mar 12, 2013 |
| Priority date | — |
| Expiry date | Feb 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention sets forth a hybrid memory module that combines memory devices of different types while presenting a single technology interface. The hybrid memory module includes a number of super-stacks and a first interface configured to transmit data between the super-stacks and a memory controller. Each super-stack includes a number of sub-stacks, a super-controller configured to control the sub-stacks, and a second interface configured to transmit data between the sub-stacks and the first interface. Combining memory devices of different types allows utilizing the favorable properties of each type of the memory devices, while hiding their unfavorable properties from the memory controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.