Device for releasably receiving a semiconductor chip
US8399265B2 · kind B2 · utility
0Cited by
2References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 14, 2011 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | May 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device is disclosed for releasably receiving a singulated semiconductor chip having a first main surface and a second main surface opposite the first main surface. The device includes a support structure. At least one elastic element is arranged on the support structure. Electrical contact elements are arranged on the at least one elastic element and adapted to be contacted to the first main surface of the semiconductor chip. A foil is adapted to be arranged over the second main surface of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.