Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof
US8399306B2 · kind B2 · utility
2Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2011 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | May 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.