JunMo Koo
6Patents
2h-index
18Co-inventors
44Inventor score
Filing activity: Mar 25, 2011 → Jan 21, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9257411B2 | Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation | Electricity | 6 | Active |
| US9202793B1 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Electricity | 2 | Active |
| US9865554B2 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Electricity | 2 | Active |
| US8399306B2 | Integrated circuit packaging system with transparent encapsulation and method of manufacture thereof | Electricity | 2 | Active |
| US12388046B2 | Semiconductor package | Electricity | 0 | Active |
| US9059157B2 | Integrated circuit packaging system with substrate and method of manufacture thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.