Semiconductor package
US8399984B2 · kind B2 · utility
1Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2009 |
| Grant date | Mar 19, 2013 |
| Priority date | — |
| Expiry date | Aug 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprises a semiconductor chip, through electrodes and cooling parts. The semiconductor chip has bonding pads on an upper surface thereof. The through-electrodes are formed in the semiconductor chip. The cooling parts are formed in the semiconductor chip and on the upper surface of the semiconductor chip in order to dissipate heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.