Electroless copper plating solution
US8404035B2 · kind B2 · utility
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1Claims
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Key dates
| Filing date | Jul 30, 2004 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Jan 16, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating solution that is favorable to improve the adhesion of a plating film and realizes uniform plating at a low temperature is characterized by containing a water-soluble nitrogen-containing polymer in an electroless copper plating solution, and preferably the above-mentioned electroless copper plating solution contains glyoxylic acid and phosphinic acid as reducing agents. The water-soluble nitrogen-containing polymer is preferably a polyacrylamide or a polyethyleneimine and, preferably, its weight average molecular weight (Mw) is at least 100,000 and Mw/Mn is 10.0 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.