LED substrate processing
US8404499B2 · kind B2 · utility
459Cited by
7References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 15, 2010 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Dec 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention pertain to substrate processing equipment and methods incorporating light emitting diodes (LEDs) for thermally processing substrates. Such light sources offer a variety of advantages including higher efficiency and more rapid response times. Pulse widths are selectable down to under a millisecond but can be for long pulses up to and exceeding a second. LEDs are preferable to tungsten-halogen lamps even in circumstances that allow longer processing times, since LEDs produce light with greater than 50% efficiency and tungsten-halogen lamps operate with less than 5% efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.