Heat sink integrated power delivery and distribution for integrated circuits

US8405998B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Harry Barowski · Balingen, DE
• Thomas J. Brunschwiler · Thalwil, CH
• Hubert Harrer · Böblingen, DE
• Andreas Huber · Holzgerlingen, DE
• Bruno Michel · Thalwil, CH
• Tim Niggemeier · Laatzen, DE
• Stephan Paredes · Thalwil, CH
• Jochen Supper · Herrenberg, DE

Key dates

• Filing date: Oct 28, 2010
• Grant date: Mar 26, 2013
• Expiry date: Jul 14, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.