Detecting dose and focus variations during photolithography
US8407632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | Mar 26, 2013 |
| Priority date | — |
| Expiry date | Dec 7, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70658
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method, system, and computer usable program product for detecting dose and focus variations during photolithography are provided in the illustrative embodiments. A test shape is formed on a wafer, the wafer being used to manufacture integrated circuits, the test shape being formed using a dose value and a focus value that are predetermined for the manufacturing. A capacitance of the test shape is measured. The capacitance is resolved to a second dosing value and a second focus value using an extraction model. A difference between the dosing value and the second dosing value is computed. A recommendation is made for dosing adjustment in the manufacturing based on the difference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.