Integrated circuit packaging system with an interposer substrate and method of manufacture thereof
US8409917B2 · kind B2 · utility
14Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2011 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Apr 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing of an integrated circuit packaging system includes: providing a base substrate; mounting a first die over the base substrate; mounting a second die over the first die; attaching an interposer substrate over the first die with an attachment adhesive therebetween, the interposer substrate having a central cavity and the second die within the central cavity; attaching a lateral interconnect to a second active side away from the first die of the second die and to the interposer substrate; and encapsulating the first die and the second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.