Patent · US Active

Method of forming a semiconductor package including two devices

US8415203B2 · kind B2 · utility

1Cited by

26References

21Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Kenneth R. Burch · Austin, US
Marc Alan Mangrum · Austin, US
William H. Lytle · Chandler, US

Key dates

Filing date	Sep 29, 2008
Grant date	Apr 9, 2013
Priority date	—
Expiry date	Nov 23, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18162
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a semiconductor package includes providing a carrier, attaching a first surface of a first device on the carrier, wherein the first surface comprises a first active surface of the first device, and attaching a second surface of a second device on the carrier. In one embodiment, the second surface is opposite a third surface of the second semiconductor die and the third surface comprises a second active surface. A first insulating material can be formed between the first device and the second device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.