Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
US8415810B2 · kind B2 · utility
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14References
8Claims
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Key dates
| Filing date | Jun 15, 2011 |
| Grant date | Apr 9, 2013 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.