Patent · US Active

Method for producing a micromechanical component having a filler layer and a masking layer

US8419957B2 · kind B2 · utility

0Cited by
2References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 8, 2008
Grant dateApr 16, 2013
Priority date
Expiry dateDec 22, 2029

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2201/0197
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.