Patent · US Active

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

US8420447B2 · kind B2 · utility

267Cited by

8References

20Claims

0Family size

Assignee

STATS ChipPAC, Ltd. · SG

Inventors

Lionel Chien Hui Tay · Singapore, SG
Henry Descalzo Bathan · Singapore, SG
Zigmund Ramirez Camacho · Singapore, SG

Key dates

Filing date	Mar 23, 2011
Grant date	Apr 16, 2013
Priority date	—
Expiry date	Mar 23, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit packaging system and method of manufacture thereof includes: leads and a paddle; a first encapsulant molded between the leads and the paddle, the first encapsulant thinner than the leads; a non-conductive layer over the paddle; and conductive traces directly on the leads, the first encapsulant, and the non-conductive layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.