Structure and method for replacement metal gate field effect transistors
US8420491B2 · kind B2 · utility
7Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2010 |
| Grant date | Apr 16, 2013 |
| Priority date | — |
| Expiry date | Apr 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/0186
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method for replacement metal gate (RMG) field effect transistors is disclosed. Silicide regions are formed on a raised source-drain (RSD) structure. The silicide regions form a chemical mechanical polish (CMP) stopping layer during a CMP process used to expose the gates prior to replacement. Protective layers are then applied and etched in the formation of metal contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.