Surface charge enhanced atomic layer deposition of pure metallic films
US8425987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2008 |
| Grant date | Apr 23, 2013 |
| Priority date | — |
| Expiry date | Sep 6, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/487
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method including applying an electric charge to a substrate in a chamber; introducing an organometallic substituent into the chamber, the organometallic substituent including a metal ligand and an organic ligand; and depositing a metal film by reducing the metal ligand of the organometallic substituent. A method including applying a removable electric charge to a substrate; in the presence of the applied electric charge, introducing an organometallic substituent into the chamber, the organometallic substituent including a metal ligand and an organic ligand; and depositing a metal film by reducing the metal ligand of the organometallic substituent. A method including introducing an organometallic substituent into the chamber, the organometallic substituent including a metal ligand and an organic ligand; and depositing a metal film by reducing the metal ligand of the organometallic substituent with an externally applied electric charge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.