Patent · US Active

MEMS microphone packaging and MEMS microphone module

US8428286B2 · kind B2 · utility

12Cited by

1References

26Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Marc Fueldner · Neubiberg, DE
Martin Wurzer · Munich, DE
Alfons Dehe · Reutlingen, DE

Key dates

Filing date	Nov 30, 2009
Grant date	Apr 23, 2013
Priority date	—
Expiry date	Oct 8, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.