Chemical-mechanical planarization pad
US8430721B2 · kind B2 · utility
1Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2008 |
| Grant date | Apr 30, 2013 |
| Priority date | — |
| Expiry date | Oct 10, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.