Substrate cleaning chamber and cleaning and conditioning methods
US8435379B2 · kind B2 · utility
4Cited by
28References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2007 |
| Grant date | May 7, 2013 |
| Priority date | — |
| Expiry date | Jan 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate cleaning chamber includes a contoured ceiling electrode having an arcuate surface that faces a substrate support and has a variable cross-sectional thickness to vary the gap size between the arcuate surface and the substrate support to provide a varying plasma density across the substrate support. A dielectric ring for the cleaning chamber comprises a base, a ridge, and a radially inward ledge that covers the peripheral lip of the substrate support. A base shield comprises a circular disc having at least one perimeter wall. Cleaning and conditioning processes for the cleaning chamber are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.