Patent · US Active

Method of slimming radiation-sensitive material lines in lithographic applications

US8435728B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

TOKYO ELECTRON LIMITED · JP

Inventors

Michael A. Carcasi · Austin, US
Benjamin M. Rathsack · Austin, US
Mark H. Somervell · Richardson, US

Key dates

Filing date	Mar 31, 2011
Grant date	May 7, 2013
Priority date	—
Expiry date	Sep 23, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67207
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and system for patterning a substrate using a radiation-sensitive material is described. The method and system include forming a layer of radiation-sensitive material on a substrate, exposing the layer of radiation-sensitive material to a pattern of radiation, and then performing a post-exposure bake following the exposing. The imaged layer of radiation-sensitive material is then developed to remove either a region having high radiation exposure or a region having low radiation exposure to form radiation-sensitive material lines. An exposure gradient within the radiation-sensitive material lines is then removed, followed by slimming the radiation-sensitive material lines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.