Patent · US Active

Device and method for making a semiconductor device including bonding two bonding partners

US8439249B2 · kind B2 · utility

0Cited by

6References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Roland Speckels · Kamen, DE
Thomas Licht · Warstein, DE
Karsten Guth · Soest, DE

Key dates

Filing date	Sep 25, 2009
Grant date	May 14, 2013
Priority date	—
Expiry date	Jun 23, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device and a method for making a semiconductor device including bonding a first bonding partner to a second bonding partner. The device comprises a lower tool and an upper tool, the upper tool including a plunger having a bottom side facing the lower tool at which bottom side a vacuum is creatable, so that the first bonding partner can be picked up by vacuum from the upper tool and positioned on the second bonding partner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.