Chemical mechanical polisher with heater and method
US8439723B2 · kind B2 · utility
12Cited by
45References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2008 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | May 16, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/015
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.