Film deposition apparatus and method
US8440270B2 · kind B2 · utility
2Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2007 |
| Grant date | May 14, 2013 |
| Priority date | — |
| Expiry date | Sep 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/06
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A film deposition apparatus which comprises: a processing chamber having a space inside which serves as a vacuum space to which a film deposition gas is supplied; a substrate supporting unit which is disposed in the vacuum space and supports a substrate; a coil which inductively heats the substrate supporting unit to thereby form a film from the film deposition gas on the substrate and which has been divided into regions; and a coil control unit which controls the coil region by region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.