Device for stripping a wafer from a carrier
US8443864B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2010 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Mar 20, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.