Method of manufacturing chemical mechanical polishing layers
US8444727B2 · kind B2 · utility
2Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2011 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Oct 6, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of density defects in the polishing layers is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.