Inventor · Norristown, PA, US

James Murnane

13Patents

5h-index

27Co-inventors

55Inventor score

Filing activity: Aug 16, 2011 → Mar 28, 2014

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9259820B2	Chemical mechanical polishing pad with polishing layer and window	Electricity	32	Active
US8709114B2	Method of manufacturing chemical mechanical polishing layers	Performing Operations; Transporting	27	Active
US8986585B2	Method of manufacturing chemical mechanical polishing layers having a window	Performing Operations; Transporting	26	Active
US8980749B1	Method for chemical mechanical polishing silicon wafers	Performing Operations; Transporting	17	Active
US9064806B1	Soft and conditionable chemical mechanical polishing pad with window	Emerging Cross-Sectional Technologies	7	Active
US9144880B2	Soft and conditionable chemical mechanical polishing pad	Chemistry; Metallurgy	4	Active
US9102034B2	Method of chemical mechanical polishing a substrate	Electricity	3	Active
US9238295B2	Soft and conditionable chemical mechanical window polishing pad	Chemistry; Metallurgy	2	Active
US8444727B2	Method of manufacturing chemical mechanical polishing layers	Performing Operations; Transporting	2	Active
US8888877B2	Forming alkaline-earth metal oxide polishing pad	Chemistry; Metallurgy	1	Active
US9238296B2	Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer	Chemistry; Metallurgy	1	Active
US9233451B2	Soft and conditionable chemical mechanical polishing pad stack	Chemistry; Metallurgy	1	Active
US9034063B2	Method of manufacturing grooved chemical mechanical polishing layers	Performing Operations; Transporting	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.