Method and system for template assisted wafer bonding
US8445326B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2012 |
| Grant date | May 21, 2013 |
| Priority date | — |
| Expiry date | Jun 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.