John Dallesasse
54Patents
17h-index
35Co-inventors
84Inventor score
Filing activity: Jun 24, 1991 → May 1, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8630326B2 | Method and system of heterogeneous substrate bonding for photonic integration | Electricity | 163 | Active |
| US8611388B2 | Method and system for heterogeneous substrate bonding of waveguide receivers | Electricity | 159 | Active |
| US5262360A | AlGaAs native oxide | Emerging Cross-Sectional Technologies | 96 | Expired |
| US8222084B2 | Method and system for template assisted wafer bonding | Electricity | 68 | Active |
| US5373522A | Semiconductor devices with native aluminum oxide regions | Emerging Cross-Sectional Technologies | 64 | Expired |
| US8368995B2 | Method and system for hybrid integration of an opto-electronic integrated circuit | Electricity | 58 | Active |
| US5696023A | Method for making aluminum gallium arsenide semiconductor device with native oxide layer | Emerging Cross-Sectional Technologies | 56 | Expired |
| US7941053B2 | Optical transceiver for 40 gigabit/second transmission | Electricity | 55 | Active |
| US5567980A | Native oxide of an aluminum-bearing group III-V semiconductor | Emerging Cross-Sectional Technologies | 38 | Expired |
| US8615025B2 | Method and system for hybrid integration of a tunable laser | Electricity | 32 | Active |
| US9316785B2 | Integration of an unprocessed, direct-bandgap chip into a silicon photonic device | Electricity | 31 | Active |
| US8559470B2 | Method and system for hybrid integration of a tunable laser and a phase modulator | Electricity | 30 | Active |
| US8859394B2 | Vertical integration of CMOS electronics with photonic devices | Electricity | 30 | Active |
| US7380993B2 | Optical transceiver for 100 gigabit/second transmission | Electricity | 28 | Active |
| US8445326B2 | Method and system for template assisted wafer bonding | Electricity | 24 | Active |
| US8605766B2 | Method and system for hybrid integration of a tunable laser and a mach zehnder modulator | Electricity | 20 | Active |
| US8722464B2 | Method and system for template assisted wafer bonding | Electricity | 17 | Active |
| US9882073B2 | Structures for bonding a direct-bandgap chip to a silicon photonic device | Electricity | 16 | Active |
| US7359642B2 | Modular optical receiver | Physics | 12 | Expired |
| US7359641B2 | Modular optical transceiver | Electricity | 10 | Expired |
| US9091813B2 | Systems and methods for photonic polarization beam splitters | Physics | 10 | Active |
| US8867578B2 | Method and system for hybrid integration of a tunable laser for a cable TV transmitter | Electricity | 10 | Active |
| US7325983B1 | 10GBASE-LX4 optical transceiver in XFP package | Physics | 9 | Active |
| US6974260B2 | Flexible substrate for routing fibers in an optical transceiver | Physics | 9 | Expired |
| US7463830B2 | Modular optical transmitter for WWDM transceivers | Electricity | 8 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.