Skorpios Technologies, Inc.
116Patents
116Active
116Granted
60Portfolio score
Filing activity: Oct 12, 2010 → May 1, 2024 · 6 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8630326B2 | Method and system of heterogeneous substrate bonding for photonic integration | Electricity | 163 | Active |
| US8611388B2 | Method and system for heterogeneous substrate bonding of waveguide receivers | Electricity | 159 | Active |
| US8222084B2 | Method and system for template assisted wafer bonding | Electricity | 68 | Active |
| US8368995B2 | Method and system for hybrid integration of an opto-electronic integrated circuit | Electricity | 58 | Active |
| US9829631B2 | Vertical output couplers for photonic devices | Physics | 41 | Active |
| US10132996B2 | Back side via vertical output couplers | Physics | 35 | Active |
| US9097846B2 | Integrated waveguide coupler | Physics | 33 | Active |
| US8615025B2 | Method and system for hybrid integration of a tunable laser | Electricity | 32 | Active |
| US9316785B2 | Integration of an unprocessed, direct-bandgap chip into a silicon photonic device | Electricity | 31 | Active |
| US8859394B2 | Vertical integration of CMOS electronics with photonic devices | Electricity | 30 | Active |
| US8559470B2 | Method and system for hybrid integration of a tunable laser and a phase modulator | Electricity | 30 | Active |
| US8445326B2 | Method and system for template assisted wafer bonding | Electricity | 24 | Active |
| US8605766B2 | Method and system for hybrid integration of a tunable laser and a mach zehnder modulator | Electricity | 20 | Active |
| US8722464B2 | Method and system for template assisted wafer bonding | Electricity | 17 | Active |
| US9882073B2 | Structures for bonding a direct-bandgap chip to a silicon photonic device | Electricity | 16 | Active |
| US9209142B1 | Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal | Electricity | 16 | Active |
| US10678073B2 | On-chip high capacitance termination for transmitters | Electricity | 15 | Active |
| US9268088B2 | Integrated waveguide coupler | Physics | 13 | Active |
| US11585977B2 | Broadband back mirror for a photonic chip | Physics | 12 | Active |
| US9625651B2 | Integrated multistage taper coupler for waveguide to fiber coupling | Physics | 12 | Active |
| US9885832B2 | Waveguide mode expander using amorphous silicon | Physics | 11 | Active |
| US9922967B2 | Multilevel template assisted wafer bonding | Electricity | 11 | Active |
| US9658401B2 | Waveguide mode expander having an amorphous-silicon shoulder | Physics | 10 | Active |
| US9091813B2 | Systems and methods for photonic polarization beam splitters | Physics | 10 | Active |
| US8867578B2 | Method and system for hybrid integration of a tunable laser for a cable TV transmitter | Electricity | 10 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.